Fig. 1. Sample Layout Drawing of ORCA-PSG Batch Process Station for PSG Glass Removal
Etch Batch Process For 1500 WPH Multi-Crystal Silicon Wafer Solar Process Line
Process Steps:
- Thin glass Etch
- DI Rinse
- Drying (Heated DI Slow Pull and Air Knife)
Key Features
- High throughput with multiple robots, 1500 to 3000 wafers per hour
- Automated staging with 6 cassette input and output
- Low cost of ownership; extended bath life, reuse of rinsing water
- Input and output scales for wafer thickness metrics plus supporting software
- Minimal wafer breakage (>1 in 500)
- Minimal downtime for bath replacement, (<1 hour bath change)
- Monitoring bath metrics such as pH and temperature, plus concentration as an option
- Process support provided, optimized texturing and PSG removal process
- Safety is designed and built in; HF monitors, fire suppression, and SEMI safety compliant
- Software is SECS /GEM compliant
- System is SEMI S2 compliant
Process Control
- Access control
- Multiple levels of functional security.
- Data logging
- Detail data is logged in individual daily logs for operator tool interactions, all events, alarms, and warnings.
- Lot tracking log files
- Custom trace files.
- Recipe control
- Recipe maintenance
- SECS-II GEM-compliant host interface.
- Integrates in-factory network without the need for Special software or hardware.
- Communication has been an essential part of the product line since inception.
- SECS protocol was implemented and used internally within the process control network.
