Orca-PSS - Post Saw Slurry Removal

Si Wafer Cleaning- Post-Saw

• Surfactant/soap 1 and 2 with sonic agitation
• Acid bath if HF
• Acid bath if KOH or other alkaline
• DI Rinse Bath

Key Features

• High throughput with multiple robots, 1500 to 3000 wafers per hour
• Automated staging with 6 cassette input and output
• Low cost of ownership; extended bath life, reuse of rinsing water
• Input and output scales for wafer thickness metrics plus supporting software
• Minimal wafer breakage (>1 in 500)
• Minimal downtime for bath replacement, (<1 hour bath change)
• Monitoring bath metrics such as pH and temperature, plus concentration as an option
• Process support provided, optimized texturing and PSG removal process
• Safety is designed and built in; HF monitors, fire suppression, and SEMI safety compliant
• Software is SECS /GEM compliant
• System is SEMI S2 compliant

Process Control

• Access control
• Multiple levels of functional security.
• Data logging
• Detail data is logged in individual daily logs for operator tool interactions, all events, alarms, and warnings.
• Lot tracking log files
• Custom trace files.
• Recipe control
• Recipe maintenance
• SECS-II GEM-compliant host interface.
• Integrates in-factory network without the need for Special software or hardware.
• Communication has been an essential part of the product line since inception.
• SECS protocol was implemented and used internally within the process control network.