Fig. 1. Sample Layout Drawing of ORCA-S Batch Process Line for Single Crystal Saw Damage Removal, Texturization and Clean
Alkaline Batch Process For 1500 WPH Single Crystal Silicon Wafer Solar Process Line
Process Steps
- Saw damage removal (Heated KOH)
- Texturing (Alkaline texturing with KOH/IPA)
- DI rinse
- Native oxide/metal removal (HF/HCL)
- DI rinse
- Drying (Heated DI slow pull and air knife)