MicroTech Orca Series
Optimized for manufacturing photovoltaic solar wafers.
MicroTech Orca wet processing systems are configurable, automated, modular, linear batch immersion systems made for high throughput at a low cost. They are designed to handle photovoltaic/ solar wafers for many applications.
Our propriety FlexBench™ design is modular and flexible as your process evolves. Fully upgradeable at your location, a section of the station can be removed and replaced with new components.
Systems are available for
Single Crystal Texturing (Orca-S),
Multi Crystal Texturing (Orca-M),
PSG Glass Removal (Orca-PSG) and
Post Saw Slurry Removal (Orca-PSS).
Features and Benefits
Modular design for flexibility and ease of change
Upgradeable in the field as processes change
Expert process support including proprietary solar processes
Event and recipe driven process controls
High throughput up to 3000 WPH
High reliability
Production ready and maintenance friendly
Built to the highest safety standards
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Solar Cell Texturing: A Simplified Recipe
Photovoltaic manufacturing is based on the ability to manufacture large volumes of high efficiency solar cells at low costs. This paper presents a method for cost reduction and green processing by replacing cleaning baths with simplified rinsing processes. The simplified process produces results that are equivalent to an ECN-based process, yet achieve a faster throughput, lower cost, and smaller footprint.
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MicroTech Orca Systems Incorporate These Critical Process Steps
Pre-Cleaning, Saw Damage Removal
Initial organic and particle cleaning of incoming wafer material in hot alkaline cleaning mixtures (up to 80 °C) Optional ultrasonic power integration for improvement of cleaning efficiency
Alkaline Texturing (ALTEX)
Preferably dedicated for texturing of monocrystalline Si-wafers Removal of crystalline surface defects, forming random pyramides Uniform etching
Acidic Texturing (ISOTEX)
Preferred process for state-of-the-art texturing of multicrystalline Si wafers Removal of crystalline surface defects by using HF-HNO3 mixtures The high-flow bath recirculation in association with the effective chilling system guarantees excellent temperature control NOX-emmisson control during ongoing process and carrier transfer
Porous Si-Etch (PorSi)
Short dip-treatment in a cold alkaline solution etches off the thin layer of porous silicon, caused by previous isotexturing step
Cleaning
Acidic cleaning using HF and HCl for effective removal of metal contaminations and native oxides
Removal of P-doped SiO2-layer from wafers, formed during previous POCl-diffusion Self-limiting ambient DHF etch
Rinsing
Optimized rinsing technology in terms of Fresh water flow Partial water reclaim Mechanical support and temperature enhancements Intelligent combination of highly effective dump-spray- rinse and water-saving multi-cascade overflow rinse
Drying
Stress-free 2-step drying process ensures perfect uniform, chemical and spot-free drying of wafers down to 150 µm with lowest risk of breakage Compatible with all common Low Surface Carrier types