Stripping

Effective stripping of photoresist and removing residue are critical to high-yielding processes. The SPM (sulfuric peroxide mixture) or solvent and semi-aqueous chemistry is used for various wet stripping processes including:

• photoresist removal
• residue removal

The SPC process can be combined with a particle and oxide removal process for post-resist strip cleaning using SC-1, HF, or other chemicals.

Read our White Paper outlining these process steps, including a section on post SMP rinsing and drying.