MicroTech Systems, Inc. Engineering Wet Process Solutions

Call us Toll Free 877.298.9562

About Mt systems Inc

An acknowledged leader in the engineering, manufacturing and support of wet process and chemical distribution equipment as well as on-site service, repair and maintenance.

 

Headquarters:

MT Systems Inc.
580 Cottonwood Drive
Milpitas, CA 95035

Tel: (510) 651-5277
Fax: (510) 651-3374

Contact Us

Partner with Us


MicroTech Office Location - Fremont, CA

News & Press Releases

All Wet:  LEDs Produced on Patterned Sapphire Substrates with MicroTech’s Wet Process Improve Overall Efficiency

Switching from dry process to wet produces lower capital and manufacturing costs, scalability, and better throughput

November 29, 2011, Fremont CA – MicroTech (MT Systems) has developed a wet process station for the etching of PSS (Patterned Sapphire Substrate) wafers used to increase light extraction and efficiency in high brightness LEDs. The wet station can improve manufacturing throughput, a major stumbling block to making LEDs price competitive with fluorescent lighting.

As LED manufacturers look to decrease costs, the use of PSS becomes more important. The average light output power is reported to be up to 37% larger on a PSS than a standard sapphire wafer. The use of patterned sapphire substrates reduces the dislocation density in the GaN (gallium nitride) layer and enhances the LEE (light extraction efficiency) from the LED chip.

Traditional dry etching on PSS produces highly efficient, very bright light but throughput is slow and scalability is impacted as wafer sizes increase. Typically, more dry etch tools are needed to keep throughput up as wafer size increases.

In the wet etch process in the MicroTech, GaN or InGaN (indium gallium nitride) coated wafers are submerged in the etch tank with a mixture of etching and buffering agents. Prior to submersion, a silicon dioxide mask is patterned using PECVD (plasma enhanced chemical vapor deposition). A lithography step exposes the desired pattern to etch. The sapphire etch process takes place between 260°C and 300°C. This ultra high temperature etches the wafers exponentially more quickly than the standard 150-180°C process and therefore, speeds throughput.

Independent customer evaluations show a significant improvement in light extraction and efficiency in the substrates and a considerable cost savings, even if polishing work is performed on the wafers after etch to increase efficiencies. Development work is also being done to improve the dome shapes created on the wafers with a CMP (chemical mechanical polishing) process. New non-cone shapes are also under development.

Recently MicroTech announced the delivery of a similar concept process station to the solar industry that delivers high throughput and lower cost-of-ownership benefits by moving from a dry CVD process to an efficient, production-proven, environmentally friendly wet process.

About MT Systems Inc.

With over 25 years’ experience in high technology equipment manufacturing, MicroTech (MT Systems Inc.) provides engineering, manufacturing and applications support for wet process and chemical distribution tools. Their innovative “intelligent process station” to monitor, measure and control the process makes their tools more efficient with a lower cost-of-ownership. They supply the semiconductor, solar, MEMS, LED, Biotech and FPD industries from their Silicon Valley headquarters, which includes a state-of-the-art cleanroom and process development lab. See www.microtechprocess.com.

Company Contact: Tom Halloran, MicroTech, 925.820.2865 or
Tom.Halloran@mt-sys.com

510.651.5277

Monday - Friday 8am - 6pm PST

 

 

© 2000 - 2024    MT Systems Inc.